Wafer exposure apparatus

Details Wafer exposure apparatus Wafer exposure apparatus

1982-04-30

1986-09-23

Braun, Fred L.

Photocopying

Projection printing and copying cameras

Step and repeat

355 43, G03B 2742, G03B 2752, G03B 2770

Patent

active

046132309

ABSTRACT:
A wafer exposure apparatus for covering the entire surface of a wafer with an array of desired chip patterns in a step and repeat process of projecting the desired chip pattern on a wafer by using a mask having the desired chip pattern. An alignment mark or chip specification mark is provided to a predetermined region of the wafer by a mask other than the mask having the desired chip pattern.

REFERENCES:
patent: 3907425 (1975-09-01), Isamu et al.
patent: 4172656 (1979-10-01), Lacombat et al.
patent: 4418467 (1983-12-01), Iwai
patent: 4422755 (1983-12-01), Phillips
patent: 4452526 (1984-06-01), Johannsmeier et al.

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