Contact carriers (tiles) for populating larger substrates with s

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29840, 228179, 324756, 437 8, 439 54, 439 66, 439591, H01R 4316, H05K 111

Patent

active

058061819

ABSTRACT:
The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated from a semiconductor wafer.

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IBM Tech. Discl Bulletin vol. 17 No. 2 Jul. 1974 Multi Point Test Probe for Printed Cards by U. Rey.
IBM Tech Discl Bulletin vol. 21 No. 8 Jan. 1979, pp. 3235-3236.
IBM Tech Discl Bulletin vol. 21 No. 4 Sep. 1978, pp 1404-1405.

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