Method of manufacturing a planar coil using a transparency subst

Details Method of manufacturing a planar coil using a transparency subst Method of manufacturing a planar coil using a transparency subst

1997-10-10

1999-10-26

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C25D 502

Patent

active

059721936

ABSTRACT:
The present invention uses a glass to act as a substrate. A stencil layer is patterned on the top surface of the substrate. Successively, a copper layer is deposited over the substrate. Next step is to remove the stencil layer. A negative photoresist layer is formed on the copper layer. A negative photoresist layer is processed using a backside exposure of the resist through the transparent substrate. The backside exposure technique uses the self-aligning, conductive copper layer as a mask. A plurality of trenches are then created in the photoresist layer and a second copper layer is electroplated in the trenches to form the planar coils.

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patent: 5646464 (1997-07-01), Sickafus

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