Apparatus for loading and re-slicing semiconductor wafer

Metal working – Barrier layer or semiconductor device making

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Details

51 73R, 51 5B, 51215UE, 125 1302, B24B 700, B24B 720, B28D 104

Patent

active

051427567

ABSTRACT:
The present invention is directed to an apparatus for loading an unprocessed semiconductor wafer which is doped in advance with impurity diffusion layers on both sides or not doped, re-slicing the wafer and unloading two sheets of the re-sliced wafer as processed wafers upon completion of re-slicing the unprocessed wafer into two sheets to a recovery wafer magazine as a total system. More particularly, the present invention provides an improved loading and unloading mechanism arranged between a storage space of both unprocessed and processed wafers and a re-slicing mechanism, with chucking mechanisms and wafer magazines in the storage space. The loading and unloading mechanism includes a loading manipulator and an unloading manipulator, wherein the loading manipulator receives an unprocessed wafer from the storage space and then conveys and loads the wafer on a chucking mechanism which is operated in combination with a re-slicing mechanism, and then the unloading manipulator recovers two sheets of re-sliced wafers from the chucking mechanism and further unloads them into another wafer magazine. While the unloading manipulator is unloading the two sheets of re-sliced wafers into the magazine, simultaneously the loading manipulator will take out a new unprocessed wafer, wherein the new wafer is conveyed to a stand-by position and awaits until the completion of re-slicing an earlier wafer on the chucking mechanism.

REFERENCES:
patent: 4261781 (1981-04-01), Edmonds et al.
patent: 4420909 (1983-12-01), Steere, Jr.
patent: 4771759 (1988-09-01), Zoebeli
patent: 4852304 (1989-08-01), Honda et al.
patent: 4899719 (1990-02-01), Abe et al.
English Translation of Claims 1 & 2 of Publication No. 64-19729.
English Translation of Claims 1 & 2 of Publication No. 1-293613.

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