Connection lead stucture for surface mountable printed circuit b

Details Connection lead stucture for surface mountable printed circuit b Connection lead stucture for surface mountable printed circuit b

1993-10-28

1995-01-17

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361772, 361774, 361776, 439 68, 439 70, H01R 900

Patent

active

053830946

ABSTRACT:
A specially designed electronic component is surface mounted on a printed circuit board substrate member having a spaced series of electrically conductive circuitry connection portions disposed on a side surface thereof. The electronic component has a body portion with a spaced series of elongated metal lead members fixedly secured thereto and projecting outwardly therefrom. Longitudinal portions of the lead members are soldered to the circuitry connection portions. Side surface areas of these longitudinal portions are clad with a second metal material having a coefficient of thermal expansion substantially different than that of the underlying longitudinal lead member portions. During fabrication of the circuit board a solder paste material is deposited on the circuitry connection portions and the lead member longitudinal portions are placed in a closely adjacent, aligned relationship with the circuitry connection portions. A conventional reflow process is then used to solder the lead members to the circuitry portions. Upon receipt of the soldering heat the longitudinal portions of the bimetal lead member structures are thermally deflected toward the circuitry connection portions, thereby automatically compensating for misalignments between the longitudinal lead member portions and the circuitry connection portions.

REFERENCES:
patent: 5034802 (1991-07-01), Liebes, Jr. et al.
patent: 5214563 (1993-05-01), Estes

Affiliated with

Also associated with

Rating

Connection lead stucture for surface mountable printed circuit b does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Connection lead stucture for surface mountable printed circuit b, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connection lead stucture for surface mountable printed circuit b will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-751290