Metal treatment – Compositions – Heat treating
Patent
1981-11-18
1983-07-19
Ozaki, G.
Metal treatment
Compositions
Heat treating
148171, 148179, 75 65ZM, 156604, H01L 2124
Patent
active
043941834
ABSTRACT:
This invention is a technique for forming a specifically configured region of material which is rejected by an advancing freezing front within a melt. Resolidification of the molten material is effected in such a manner that liquid-solid interfaces intersect so as to control the shape and location of the rejected material which solidifies. Specific embodiments involve the formation of wires, tubes, or planes of enriched rejected material. Applications include the formation of enriched conductive material for making electrical contact between internal or external regions of electronic devices. Additionally, enriched material with etching properties different than that of the surrounding material may be formed and subsequently etched away in micro-machining applications.
REFERENCES:
patent: 2739088 (1956-03-01), Pfann
patent: 2813048 (1957-11-01), Pfann
patent: 3179542 (1965-04-01), Quinn et al.
patent: 3940289 (1976-02-01), Marquardt et al.
patent: 4033786 (1977-07-01), Anthony et al.
patent: 4136435 (1979-01-01), Li
patent: 4257824 (1981-03-01), Jackson et al.
B. Chalmers, Principles of Solidification, Chapt. 4, "Microscopic Heat Flow Considerations" and Chapt. 5, Redistribution of Solute During Solidification, pp. 91-180, (1964).
Jackson Kenneth A.
Kimerling Lionel C.
Bell Telephone Laboratories Incorporated
Dworetsky Samuel H.
Ozaki G.
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