Packaged microwave semiconductor device

Details Packaged microwave semiconductor device Packaged microwave semiconductor device

1993-03-17

1995-01-17

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

257508, 257630, 257668, 257686, 174254, 361749, H01L 4900, H01L 2348, H01L 2704, H01L 2934

Patent

active

053828291

ABSTRACT:
A semiconductor device including an insulating film substrate having a surface, a high frequency semiconductor chip disposed on the surface, and circuit elements disposed on the surface and connected to the semiconductor chip wherein the insulating film substrate is bent into a U-shape, laminated, and encapsulated with a resin. The package of the device is miniaturized.

REFERENCES:
patent: 3533023 (1970-10-01), Friend et al.
patent: 3766439 (1973-10-01), Isaacson
patent: 3911234 (1975-10-01), Kotaka
patent: 4550357 (1985-10-01), Matsumoto
patent: 4956695 (1990-09-01), Robinson et al.
patent: 5128744 (1992-07-01), Asano et al.

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