Method of correcting defects in the pattern of phase shift mask

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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430321, 430323, 156646, G03F 900

Patent

active

053824849

ABSTRACT:
A method of correcting a pattern defect in a phase shift mask allowing planarization of bump and divot defects in a phase shift mask with high accuracy is disclosed. In the case of a bump defect, the region including the bump defect is irradiated with an FIB and supplied with a deposition gas, thereby forming a planarization film, and then the planarization film is etched back with the FIB. Thereafter, a layer containing ions is removed away using a laser beam. In the case of a divot defect, the region including the divot defect is planarized by application of an SOG film, and then the unnecessary part of the SOG film other than in the region of the divot defect is removed away by etching back to the interface of the SOG film with the FIB and developing the same. Thereafter, the layer containing ions is removed away utilizing a laser beam.

REFERENCES:
patent: 4457803 (1984-07-01), Takigawa
patent: 4548883 (1985-10-01), Wagner
patent: 4698236 (1987-10-01), Kellogg et al.
patent: 4849642 (1989-07-01), Katsumi

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