Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1993-02-05
1995-07-25
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
165 804, 361699, H01L 2504
Patent
active
054365015
ABSTRACT:
A cooling structure for an integrated circuit that uses a liquid coolant to absorb heat directly from the integrated circuit includes a wiring substrate, an integrated circuit mounted on the wiring substrate, and a hollow cooling block, in which liquid coolant accumulates, disposed on a heat radiating surface of the integrated circuit. The upper portion of the cooling block is provided with an inlet port and an outlet port to allow the liquid coolant to enter and exit, respectively. A nozzle is mounted on the inlet port to jet the liquid coolant to the heat radiating surface. The lower portion of the cooling block consists of an opening portion which is opposed to the heat radiating surface, and which allows the liquid coolant to come in contact with and directly cool the heat radiating surface. The opening portion is liquid-tightly sealed to the heat radiating surface by a sealing member and/or a frame mounted on the heat radiating surface.
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Arroyo Teresa M.
Hille Rolf
NEC Corporation
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