Semiconductor device having U-groove

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357 55, 357 54, 357 47, H01L 2712

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051482576

ABSTRACT:
A dielectric isolation region of a bipolar semiconductor device having a U-groove which is covered over the inner surface thereof with an insulating film, and is filled with polysilicon. The surface of the U-groove polysilicon is covered with a silicon nitride film deposited by CVD technique. This structure permits the earlier steps of forming the dielectric isolation region and also the later steps of forming semiconductor elements to be carried out without causing the surface of the U-groove polysilicon to suffer thermal oxidation.

REFERENCES:
patent: 4635090 (1987-01-01), Tamaki et al.
patent: 4656497 (1987-04-01), Rogers et al.
patent: 4819054 (1989-04-01), Kawaji et al.
patent: 4907063 (1990-03-01), Okada et al.
IEDM Technical Digest, Hiroshi Goto et al. "An Isolation Technology for High Performance Bipolar Memories" pp. 58-60, 1982.

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