Plating of substrates by jet printing

Details Plating of substrates by jet printing Plating of substrates by jet printing

1977-06-07

1980-12-30

Pianalto, Bernard D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427287, 427405, B05D 314

Patent

active

042423694

ABSTRACT:
In accordance with certain of its aspects, this invention relates to novel compositions and to the process for the plating of substrates by the jet printing of a metal or alloy which comprises continuously imprinting minute uniform droplets of a jet printing ink containing at least one soluble salt of at least one plate metal which is more noble than said basis metal, said jet printing ink exhibiting a viscosity at 68.degree. F. of between about 1.5 and 16 cps., said ink having a pH of between 0.5 and 9.5 and a specific resistivity of less than 10,000 ohm cm., onto a substrate, said droplets emitting from at least one ink jet electromagnetically energized to emit said droplets of ink at a rate of 8 to 150 kilohertz.

REFERENCES:
patent: 2069828 (1937-02-01), Hauptli
patent: 2873214 (1959-02-01), Schnable
patent: 3465350 (1969-09-01), Keur et al.
patent: 3465351 (1969-09-01), Keur et al.
patent: 3475143 (1969-10-01), O'Connor
patent: 3503762 (1970-03-01), Remer
patent: 3705043 (1972-12-01), Zabiak
patent: 3964914 (1976-06-01), Bullock et al.

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