Real-time multi-zone semiconductor wafer temperature and process

Fishing – trapping – and vermin destroying

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437225, 29 2501, 117 85, 374121, 374128, 374124, 374137, 2503411, H01L 2166

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active

054361729

ABSTRACT:
A real-time multi-zone semiconductor wafer temperature and process uniformity control system for use in association with a semiconductor wafer fabrication reactor comprises a multi-zone illuminator (130), a multi-point temperature sensor (132), and process control circuitry (150). The method and system of the invention significantly improved wafer (60) temperature control and process uniformity. The multi-zone illuminator module (130) selectively and controllably heats segments of the semiconductor wafer (60). Multi-point temperature sensor (132) independently performs pyrometry-based temperature measurements of predetermined points of the semiconductor wafer (60). Process control circuitry (150) operates in association with the multi-zone illuminator (130) and the multi-point temperature sensor (132) for receiving the temperature measurements and selectively controlling the illuminator module to maintain uniformity in the temperature measurements. A scatter module (116) also provides input to process control circuitry (150) for real-time emissivity compensation of the pyrometry-based temperature measurements of semiconductor wafer (60).

REFERENCES:
patent: 5156461 (1992-10-01), Moslehi et al.
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"A Model for Rapid Thermal Processing", Achieving Uniformity Through Lamp Control Ronald S. Guurcsek IEEE Transaction on Semiconductor Manufacturing vol. 4, No. 1, Feb. 1991 pp. 9-13.
"Process Uniformity and Slip Dislocation Patterns in Linearly Ramped Temperature Transient Doped Thermal Processing of Silicon" by M. M. Meslehi, IEEE Transactions on Semiconductor Manufacturing vol. 2 No. 4, Nov. 1989 pp. 130-140.

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