Electronic component carriers and method of producing the same a

Details Electronic component carriers and method of producing the same a Electronic component carriers and method of producing the same a

1993-10-18

1995-08-01

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361709, 361743, 174 522, 174260, 174263, 257698, 257706, 257796, 29877, 437180, 437902, H05K 700, H01L 2144

Patent

active

054384788

ABSTRACT:
An electronic component carrier for mounting an electronic component such as a semiconductor element, IC chip or the like comprises a printed wiring substrate having conductor pattern and thorugh-hole, an adhesive layer formed on the substrate, a lead frame joined to the substrate through the adhesive layer and comprised of plural leads for external connection, and a solder layer formed in the through-hole for electrical connection to the conductor pattern of the substrate.

REFERENCES:
patent: 4975761 (1990-12-01), Chu
patent: 5012386 (1991-04-01), McShane et al.
patent: 5067005 (1991-11-01), Michii et al.

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