Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent
1993-03-12
1995-08-01
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
257734, 257780, 257775, H01L 2348, H01L 2940, H01L 2944, A01L 2952
Patent
active
054382238
ABSTRACT:
An anisotropic electrically conductive adhesive film having fine through holes independently electroconductively passing through an insulating film in the thickness direction, at least one end portion of both the end portions of the each through hole on the front and back surfaces of said film being blocked with a bump-form metal projection having a larger base area than the area of the opening portion of the through hole, wherein the insulating film comprises a thermoplastic polyimide resin having a melt viscosity at 400.degree. C. of not higher than 1.times.10.sup.8 poise is disclosed. The film is interposed between materials to be connected to provide a connection structure.
REFERENCES:
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4970571 (1990-11-01), Yamakawa et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5027188 (1991-06-01), Owada et al.
patent: 5136359 (1992-08-01), Takayama et al.
patent: 5232702 (1993-08-01), Pfister et al.
Higashi Kazumi
Maeda Masako
Mochizuki Amane
Arroyo Teresa M.
Limanek Robert P.
Nitto Denko Corporation
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