Light erasable multichip module

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

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Details

257433, 257680, 257681, 257704, 257707, H01L 7714, H01L 3100, H01L 2302, H01L 2312

Patent

active

054382165

ABSTRACT:
A multichip circuit package is formed for use with an EPROM chip. The active circuitry on the EPROM die surface is revealed. An EPROM die (14) is mounted on an insulating substrate (10). The active circuitry (15) on the die is connected to a conductive circuit pattern (13) on the substrate by wire bonds (16) between the die and the conductive circuit pattern. A second integrated circuit die (20) is also mounted on the substrate and electrically connected to the conductive circuit pattern by wire bonds. A plastic material (50) is then molded to encapsulate the perimeter (18) of the EPROM and the associated thin wires, the entire second integrated circuit die and it's associated thin wires, at least a portion of the conductive circuit pattern, and portions of the insulating substrate. The plastic material is formed so as to expose the active circuitry on the face of the EPROM.

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IBM TDB vol. 27 No. 12 May 1985 "Field-Modifiable Electronic Devices".

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