Composite photodetector substrate and method of forming the same

Details Composite photodetector substrate and method of forming the same Composite photodetector substrate and method of forming the same

1994-08-23

1995-08-01

Dzierzynski, Paul M.

Radiant energy

Invisible radiant energy responsive electric signalling

Infrared responsive

25033902, G01N 2127

Patent

active

054382009

ABSTRACT:
A composite photodetector substrate is provided that can survive the expected functional stresses of a photodetector array and also reduce the number of photons that complete crosstalk paths in the radiation transparent substrates of typical prior photodetector arrays. The composite substrate includes a semiconductor substrate whose thickness is less than that required to survive typically expected functional stresses of the array, and a carrier bonded to the substrate to give the composite substrate the required strength. The reduced thickness of the semiconductor substrate increases the crosstalk path length which nonabsorbed photons travel between photodetectors. The increased path length includes a greater number of surface reflections, thus reducing the number of photons that complete the crosstalk path. The number is further increased by using a carrier that absorbs the radiation of interest.

REFERENCES:
patent: 5157258 (1992-10-01), Gunning, III et al.
patent: 5159199 (1992-10-01), LaBaw
patent: 5264699 (1993-11-01), Barton et al.

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