Method for filling plated through holes

Details Method for filling plated through holes Method for filling plated through holes

1993-12-23

1995-07-25

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

29830, 228216, 174264, H05K 340

Patent

active

054354803

ABSTRACT:
Plated thru holes in a printed circuit card or board are filled with solder to provide as void free as possible solder fill. According to one method, an adhesive film is provided on the bottom side of a circuit card or board containing plated thru holes. A plurality of solder balls are then provided within at least one thru hole of the card or board. The total volume of the solder balls is greater than the volume of the plated thru hole. The solder balls are reflowed to thereby fill the plated thru hole with solder and provide solder on top of the thru hole.
According to another method, a solder ball is provided above and in contact with a plated thru hole. The volume of the solder ball is greater than the volume of the plated thru hole. The solder ball is reflowed to thereby fill the plated thru hole with solder, and to provide solder both above and below the plated thru hole.

REFERENCES:
patent: 3001057 (1961-09-01), Hackman et al.
patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 5088639 (1992-02-01), Gondotra et al.
patent: 5129142 (1992-07-01), Bindra et al.
patent: 5191174 (1993-03-01), Chang et al.
patent: 5229549 (1993-07-01), Yamakawa et al.
Product Brochure, "YR-5414 Water Soluable Wave Solder Tape", 3M.

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