Semiconductor device with moisture resistant fuse portion

Details Semiconductor device with moisture resistant fuse portion Semiconductor device with moisture resistant fuse portion

1998-04-14

2000-03-21

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257665, 257173, H01L 2900, H01L 2358, H01L 2362

Patent

active

060406151

ABSTRACT:
On a semiconductor substrate, a first circuit and a second circuit are provided with a space therebetween. The first circuit and the second circuit are connected to each other by a fuse portion. In the middle of the fuse portion, a connecting portion is interposed, which is made of a material highly resistant to corrosion. Accordingly, an improved semiconductor device with a corrosion-resisting fuse portion is accomplished, which ensures the layout to be designed much more freely.

REFERENCES:
patent: 5420455 (1995-05-01), Gilmour et al.
patent: 5652459 (1997-07-01), Chen
patent: 5663590 (1997-09-01), Kapoor
patent: 5760453 (1998-07-01), Chen
patent: 5789794 (1998-08-01), Froehner
patent: 5882998 (1999-03-01), Sur, Jr. et al.

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