Method and apparatus for component pickup

Details Method and apparatus for component pickup Method and apparatus for component pickup

1998-03-04

2000-03-21

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 438464, 438976, 294266, B32B 3500

Patent

active

060398337

ABSTRACT:
A method and apparatus for removing a component retained to a film carrier by an adhesive bonding force exerted on the component by the film carrier. The method includes the steps of supporting a section of the film carrier lying beneath the component; pulling a portion of the supported film carrier section away from the component to substantially reduce the adhesive bonding force exerted on the component by the film carrier; and lifting the component off the film carrier. The apparatus for performing the method includes a convex-shaped base element having a slot which applies at least a partial vacuum that pulls the portion of the film carrier away from the component and a component pickup element for lifting the component off the film carrier.

REFERENCES:
patent: 4296542 (1981-10-01), Gotman
patent: 4921564 (1990-05-01), Moore
patent: 4990051 (1991-02-01), Safabakhsh et al.
patent: 5827394 (1998-10-01), Lu
patent: 5851664 (1998-12-01), Bennett et al.
patent: 5911850 (1999-06-01), Zung

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