Heat pipe heat sink for semiconductor devices

Details Heat pipe heat sink for semiconductor devices Heat pipe heat sink for semiconductor devices

1984-08-31

1987-06-23

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

16510414, 174 15HP, 357 82, H05K 720

Patent

active

046757830

ABSTRACT:
A heat pipe heat sink for air cooling of semiconductor devices characterized by arranging heat pipes in a zigzag form toward the direction of air flow around the fin section in the heat sinks. A block for mounting the semiconductor device is fitted to the heat-in sections of the plural heat pipes arranged in parallel, and a large number of radiating fins crossing over the heat pipes are fitted to the heat-out sections of the heat pipes protruding from the block.

REFERENCES:
patent: 3656035 (1972-04-01), Corman et al.
patent: 3951470 (1976-04-01), Devendorf

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