Vapor phase soldering using perfluorotetradecahydrophenanthrene

Details Vapor phase soldering using perfluorotetradecahydrophenanthrene Vapor phase soldering using perfluorotetradecahydrophenanthrene

1984-04-30

1985-10-29

Godici, Nicholas P.

Metal fusion bonding

Process

Preplacing solid filler

228 37, 2281801, 357 82, B23K 300

Patent

active

045496862

ABSTRACT:
A method of soldering wherein a component or components to be soldered, such as a printed circuit board and soldered preforms, are immersed in a vapor bath to melt the solder, following which the components are withdrawn from the vapor bath. In the method according to the invention, the vapor bath is composed predominantly of perfluorotetradecahydrophenanthrene (C.sub.14 F.sub.24).

REFERENCES:
patent: Re30399 (1980-09-01), Ammann et al.
patent: 4106557 (1978-08-01), Sonobe et al.
patent: 4187974 (1980-02-01), Mahajan

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