Disposable post processing for semiconductor device fabrication

Details Disposable post processing for semiconductor device fabrication Disposable post processing for semiconductor device fabrication

1995-08-17

1998-01-20

Bowers, Jr., Charles L.

Fishing, trapping, and vermin destroying

437228, 430313, H01L 21283

Patent

active

057100616

ABSTRACT:
A disposable post process allows openings to be created in a layer formed over a semiconductor wafer, for example to create self-aligned contacts. A layer of material is formed over a semiconductor wafer and subsequently patterned into posts which define the location and shape of openings to be formed in a subsequently formed planar layer. After the planar layer is formed to surround the posts, the posts are removed to create openings in the planar layer. These openings may then be used to form suitable contacts.

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