Fishing – trapping – and vermin destroying
Patent
1995-07-24
1998-01-20
Bowers, Jr., Charles L.
Fishing, trapping, and vermin destroying
437 21, 437 99, 437924, 437967, 257979, H01L 2184
Patent
active
057100500
ABSTRACT:
The semiconductor device of the invention includes: a substrate having an insulating surface; and an active region which is formed on the insulating surface of the substrate and is constituted by a crystalline silicon film. In the semiconductor device, the active region is formed inside a crystalline silicon region formed by selective crystallization of an amorphous silicon film, and the active region is positioned by performing a mask alignment using a boundary between an amorphous silicon region of the amorphous silicon film and the crystalline silicon region.
REFERENCES:
patent: 4450041 (1984-05-01), Aklufi
patent: 4534804 (1985-08-01), Cade
patent: 4732867 (1988-03-01), Schnable
patent: 4764432 (1988-08-01), Kalbitzer
patent: 4897150 (1990-01-01), Dooley et al.
patent: 5260235 (1993-11-01), Dooley et al.
patent: 5382537 (1995-01-01), Noguchi
patent: 5413958 (1995-05-01), Imahashi et al.
patent: 5457058 (1995-10-01), Yonehara
patent: 5529937 (1996-06-01), Zhang et al.
patent: 5569610 (1996-10-01), Zhang et al.
patent: 5627086 (1997-05-01), Noguchi
D.G. Beanland et al., J. Electrochem. Soc., 125(8)(1978)1331, "Color-band generation during . . . ion implantation of Si wafers", Aug. 1978.
C.E. Hauerwas et al., IBM Tech. Discl. Bulletin, 12(10)(1970)1548, "Detection of doped regions in semiconductor devices", Mar. 1970.
Makita Naoki
Miyamoto Tadayoshi
Bowers Jr. Charles L.
Radomsky Leon
Sharp Kabushiki Kaisha
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