Method for fabricating a semiconductor device

Fishing – trapping – and vermin destroying

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437 21, 437 99, 437924, 437967, 257979, H01L 2184

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active

057100500

ABSTRACT:
The semiconductor device of the invention includes: a substrate having an insulating surface; and an active region which is formed on the insulating surface of the substrate and is constituted by a crystalline silicon film. In the semiconductor device, the active region is formed inside a crystalline silicon region formed by selective crystallization of an amorphous silicon film, and the active region is positioned by performing a mask alignment using a boundary between an amorphous silicon region of the amorphous silicon film and the crystalline silicon region.

REFERENCES:
patent: 4450041 (1984-05-01), Aklufi
patent: 4534804 (1985-08-01), Cade
patent: 4732867 (1988-03-01), Schnable
patent: 4764432 (1988-08-01), Kalbitzer
patent: 4897150 (1990-01-01), Dooley et al.
patent: 5260235 (1993-11-01), Dooley et al.
patent: 5382537 (1995-01-01), Noguchi
patent: 5413958 (1995-05-01), Imahashi et al.
patent: 5457058 (1995-10-01), Yonehara
patent: 5529937 (1996-06-01), Zhang et al.
patent: 5569610 (1996-10-01), Zhang et al.
patent: 5627086 (1997-05-01), Noguchi
D.G. Beanland et al., J. Electrochem. Soc., 125(8)(1978)1331, "Color-band generation during . . . ion implantation of Si wafers", Aug. 1978.
C.E. Hauerwas et al., IBM Tech. Discl. Bulletin, 12(10)(1970)1548, "Detection of doped regions in semiconductor devices", Mar. 1970.

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