Electrodeposition of ruthenium

Details Electrodeposition of ruthenium Electrodeposition of ruthenium

1977-04-20

1978-04-04

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

200268, 204DIG9, 204 46G, 204 47, C25D 510, C25D 700

Patent

active

040826228

ABSTRACT:
A method for the electrodeposition of a relatively thick (20 to 45 microinches) layer of ruthenium includes the step of pulse current plating an intermediate layer of gold over the substrate to be plated. The ruthenium layer so obtained is characterized by low internal stress and an absence of surface cracks.

REFERENCES:
patent: 3630856 (1971-12-01), Meyer
patent: 3749650 (1973-07-01), Dettke et al.

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