Apparatus for bonding wire leads

Details Apparatus for bonding wire leads Apparatus for bonding wire leads

1976-10-04

1977-07-26

Smith, Al Lawrence

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

29591, 228 51, 228 6A, B23K 2102, H01L 21601

Patent

active

040377725

ABSTRACT:
An ultrasonic wobble-bonding apparatus for bonding leads of lead frames has a bonding tool attached to a support member which is mounted on a double axis pivot or trunnion, the pivot or trunnion in turn mounted on a sector bearing. The interception of the two axis is on a center common with the active surface of the bonding tool, the active surface being concave. The tool is moved about the two axes in a predetermined manner such that the common center on the active surface -- which is also the contact position between tool and lead frames -- follows a predetermined path on the active surface. The pivot and sector bearing are displaced from the bonding tool to leave a clear working space -- particularly useful for automatic bonding of leads of lead frames arranged in long strips or coils.

REFERENCES:
patent: 3388848 (1968-06-01), Youmans
patent: 3698618 (1972-10-01), Helda
patent: 3882597 (1975-05-01), Chayka
patent: 3887783 (1975-06-01), Comette
patent: 3938722 (1976-02-01), Kelly
Grossman, Electronics, "Film-Carrier Technique Automates the Packaging of IC Chips," May 16, 1974, pp. 89-95.

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