Method for aligning the device layers in a semiconductor device

Details Method for aligning the device layers in a semiconductor device Method for aligning the device layers in a semiconductor device

1996-12-18

1999-09-28

Dutton, Brian

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

H01L 2176

Patent

active

059602961

ABSTRACT:
This invention relates to method for forming a semiconductor device on a semiconductor wafer comprising the following steps:
forming a plurality of device layers each including a reference mark applied thereon;
forming a composite reference mark including one or more features from each of the reference marks applied on the layers which are to be aligned;
comparing the reference mark with the features of the marks applied on the or each layer to be aligned in order to identify when the alignment is attained; and
forming a next device layer aligned with two or more of said plurality of device layers.

REFERENCES:
patent: 5532091 (1996-07-01), Mizutani
patent: 5604354 (1997-02-01), Lauverjat

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