Fishing – trapping – and vermin destroying
Patent
1994-11-01
1996-07-23
Powell, William
Fishing, trapping, and vermin destroying
1566431, 1566441, 1566511, 216 67, 437228, H01L 2100
Patent
active
055389201
ABSTRACT:
A semiconductor device has a connection electrode and protective film formed of organic material and covering the connection electrode. An opening is formed in the protective film to expose the connection electrode. A natural oxide layer is etched by argon-based dry etching. The surface layer of the protective film is altered to reduce the insulativity in the dry etching process. After a projection electrode is formed on the connection electrode later, the altered surface layer of the protective film is removed by oxygen-based dry etching. As no altered surface layer remain on the protective film, an adverse affect such as inadequate insulation does not occur.
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patent: 5244833 (1993-09-01), Gansauge et al.
Patent Abstracts Of Japan, vol. 9, No. 27 (E-294) Feb. 6, 1985 & JP-A-59 172 745 (Matsushita Denshi Kogyo KK).
Proceedings Of The IEEE Multi-Chip Module Conference MCM-93, Santa Cruz, CA., US, pp. 74-78, Ostmann et al "The pretreatment of aluminium bondpads for electroless nickel plating".
Solid State Technology, vol. 33, No. 6, Jun. 1990, Washington, D.C. US, pp. 91-94, Lo and Tjhia "Backsputtering etch studies in wafer bumping process" .
Casio Computer Co. Ltd.
Powell William
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