Multi-head die bonding system

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

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Details

156350, 156538, 156539, 156566, 29739, 29742, 29743, 29759, B32B 3100, B65C 940, B23P 1900

Patent

active

053974239

ABSTRACT:
A multi-tool bonder having a plurality of die heads flexibly mounted on a conveyor which spaces and moves the heads along a path which includes a plurality of die processing stations. An alignment mechanism is provided at each stationary processing station for aligning the head at a fixed position along the path at the station. A controller controls the conveyor to position the plurality of heads at the stations and controls operation of the heads at the stations.

REFERENCES:
patent: 2795315 (1957-05-01), Hahir et al.
patent: 4088220 (1978-05-01), Jacksch et al.
patent: 4372802 (1983-02-01), Harigane et al.
patent: 4526646 (1985-07-01), Suzuki et al.
patent: 4527327 (1985-07-01), Van Deuren
patent: 4631812 (1986-12-01), Young
patent: 4809430 (1989-03-01), Maruyama et al.
patent: 4908092 (1990-03-01), Koibuchi
patent: 4951388 (1990-08-01), Eguchi et al.

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