Polishing pad and a method for making a polishing pad with coval

Details Polishing pad and a method for making a polishing pad with coval Polishing pad and a method for making a polishing pad with coval

1996-01-22

1997-04-29

Rose, Robert A.

Abrading

Machine

Rotary tool

451921, 451526, 451532, 51293, 51298, 51306, B24B 500

Patent

active

056243030

ABSTRACT:
The present invention is a polishing pad for use in chemical-mechanical planarization of semiconductor wafers, and a method for making the polishing pad. The polishing pad has a body, molecular bonding links, and abrasive particles dispersed substantially uniformly throughout the body. The body is made from a polymeric matrix material and the molecular bonding links are covalently bonded to the matrix material. Substantially all of the abrasive particles are covalently bonded to at least one molecular bonding link. The molecular bonding links securely affix the abrasive particles to the matrix material to enhance the uniformity, of the distribution of the abrasive particles throughout the pad and to substantially prevent the abrasive particles from breaking away from the pad.

REFERENCES:
patent: 3617347 (1971-11-01), Kuratomi
patent: 4565771 (1986-01-01), Lynch et al.
patent: 5127196 (1992-07-01), Morimoto et al.
patent: 5197999 (1993-03-01), Thomas
patent: 5213588 (1993-05-01), Wong et al.
patent: 5250085 (1993-10-01), Mevissen
patent: 5433650 (1995-07-01), Winebarger

Affiliated with

Also associated with

Rating

Polishing pad and a method for making a polishing pad with coval does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing pad and a method for making a polishing pad with coval, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing pad and a method for making a polishing pad with coval will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-701874