Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1985-01-10
1986-07-29
Bueker, Richard
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 39, 427 41, 427132, 427250, 427255, 427404, 4274121, 4274191, 4274192, B05D 306
Patent
active
046030573
ABSTRACT:
The invention provides a method for the preparation of a shaped article of a flexible or semi-rigid polyvinyl chloride resin having a metallized surface, of which the adhesive bonding of the metallizing layer to the substrate surface is greatly improved. In the inventive method, the surface of the shaped article is first exposed to low temperature plasma generated in an atmosphere containing a vapor of a specified organosilicon compound before the metallizing treatment in a dry process such as vacuum vapor deposition, ion plating and the like.
REFERENCES:
patent: 4396641 (1983-08-01), Imada et al.
patent: 4429024 (1984-01-01), Ueno
patent: 4496626 (1985-01-01), Kasuga
patent: 4520070 (1985-05-01), Yamamoto
patent: 4521482 (1985-06-01), Arai
Nomura Hirokazu
Ueno Susumu
Bueker Richard
Shin-Etsu Chemical Co. , Ltd.
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