Joint structure for multilayer interconnections

Details Joint structure for multilayer interconnections Joint structure for multilayer interconnections

1996-08-13

1998-11-03

Ledynh, Bot L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361803, 174250, H01R 909

Patent

active

058312196

ABSTRACT:
A lower-layer interconnection and an upper-layer interconnection formed on the lower-layer interconnection through an interlayer insulating film interposed therebetween are connected to each other by a plurality of contact plugs the interconnections and the contact plugs providing a plurality of conductive paths. The lower-layer interconnection is made of a conductive material having a resistivity higher than the upper-layer interconnection. At least one of the conductive paths provided in the lower-layer interconnections is shorter than the other conductive paths, and the contact plug which provides the shorter conductive path has a lower resistance than the contact plugs which provide the other conductive paths. With this arrangement, the contact plug which provides the shorter conductive path is prevented from suffering an increased current density, and the current densities in the contact plugs are uniformized.

REFERENCES:
patent: 4761517 (1988-08-01), Massit et al.
patent: 4879433 (1989-11-01), Gillett et al.
patent: 5219639 (1993-06-01), Sugawara et al.
patent: 5306872 (1994-04-01), Kordus et al.

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