Method of mounting electronic components on a circuit board

Details Method of mounting electronic components on a circuit board Method of mounting electronic components on a circuit board

1993-02-10

1994-02-08

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 174254, H05K 334

Patent

active

052839478

ABSTRACT:
Anisotropic conductive material is employed instead of solder for connecting between the terminal of a component and a printed circuit board. In addition to the printed circuit board, a printed circuit sheet is provided and the terminal of the component is sandwiched between both anisotropic materials on the printed circuit board and beneath the printed circuit sheet. From both outside surfaces of the printed circuit board and the sheet, heat and pressure are simultaneously applied to the terminal part (i.e. thermocompression bonding).

REFERENCES:
patent: 4550357 (1985-10-01), Matsumoto
patent: 4631820 (1986-12-01), Harada et al.
patent: 4667401 (1987-05-01), Clements et al.
patent: 4668581 (1987-05-01), Lue et al.
patent: 4795079 (1989-01-01), Yamada
patent: 4950527 (1990-08-01), Yamada

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