Electronic component

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

174 524, 361712, H05K 500

Patent

active

058981284

ABSTRACT:
An electronic component (10) has an electrically insulating substrate (20) that is encapsulated with an electrically conductive material (15) to provide thermal dissipation for the electronic component (10). The electrically insulating substrate (20) has cavities (21-24) that are either completely filled with an electrically conductive material (15) or are partially filled to provide recesses (26-27) for electronic devices (30,31). The electronic devices (30,31) are electrically coupled to the leads (60-63) of the electronic component (10) using either wire bonds (70) or metallic depositions (55-57).

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