Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1995-12-27
1998-09-29
Picardat, Kevin
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438121, H01L 2148
Patent
active
058145362
ABSTRACT:
A method and apparatus for dissipating heat from a semiconductor device. A heat sink embodying the method includes an exterior surface contoured to better facilitate heat dissipation and/or direct a flow of air or fluid over the heat sink. In one embodiment, the heat sink includes a heat sink layer formed from a powdered metal. In another embodiment, the heat sink layer is contoured with a selected combination of bumps, indentations and holes. In yet another embodiment, the heat sink includes a stack of such heat sink layers which are mechanically interfitted and thermally coupled.
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Rostoker Michael D.
Schneider Mark
LSI Logic Corporation
Picardat Kevin
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