Package for housing photosemiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

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Details

257 98, 257432, 257433, H01L 3300, H01L 310232

Patent

active

06031253&

ABSTRACT:
A package for housing a photosemiconductor device includes: a substrate having a mounting portion for mounting a photosemiconductor device thereon; a frame attached onto the substrate so as to surround the mounting portion and having a through hole in a side portion thereof; a metallic fixing member fixed in the through hole and in which an optical fiber is to be fixed at the outer end and a cylindrical lens is fixed at the inner end; and a lid to be attached to the top surface of the frame and hermetically sealing the photosemiconductor device. Only the central region of the circumferential surface of the cylindrical lens is brazed to the inner surface of the metallic fixing member with a brazing filler metal. Consequently, outer region of the circumferential surface of the cylindrical lens near the ends thereof is not brazed, so that no stress concentrates on the cylindrical lens. As a result, the cylindrical lens is resistant to cracking. In addition to this structure, the metallic fixing member is fixed to keep a gap from the through hole. Consequently, the thermal stress of the frame does not reach the portion of the metallic fixing member where the cylindrical lens is fixed. As a result, the cylindrical lens is more resistant to cracking.

REFERENCES:
patent: 3816847 (1974-06-01), Nagao
patent: 4307934 (1981-12-01), Palmer
patent: 5132532 (1992-07-01), Watanabe
patent: 5744848 (1998-04-01), Harazono

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