Method of producing a hybrid integrated circuit

Details Method of producing a hybrid integrated circuit Method of producing a hybrid integrated circuit

1997-02-27

1999-04-27

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 8919, 156 8921, 156280, 29851, 29854, 427 96, 427 98, 361751, 174257, B32B 3126, H05K 710

Patent

active

058977244

ABSTRACT:
A multilayer substrate is constituted by laminating a plurality of sheet substrates, the respective sheet substrates are constituted by forming conductive layers of a refractory metal such as W on ceramic green sheets composed mainly of an alumina ceramic, and the ceramic green sheets are laminated and sintered to constitute the multilayer substrate. Porous conductive material layers are formed on the surface of the multilayer substrate so as to be selectively connected to the conductive layers, and copper-plated layers are formed on the porous conductive material layers. Thick film conductor layers are formed on the copper-plated layers to constitute terminal conductors, and, a thick film resistor layer for example is connected to the terminal conductors.

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