Sealing structure for bumps on a semiconductor integrated circui

Details Sealing structure for bumps on a semiconductor integrated circui Sealing structure for bumps on a semiconductor integrated circui

1995-07-21

1997-02-04

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257698, 257778, 257737, 257780, 257785, H01L 2348

Patent

active

056001800

ABSTRACT:
A sealing structure for bumps on a semiconductor integrated circuit chip to be bonded through the bumps onto a circuit board is provided wherein a plurality of pads are formed on the semiconductor integrated circuit chip. Each of the pads is formed with a bump thereon. A coating material is provided to coat at least surfaces of the above a plurality of bumps. The material is made of an insulation material having a hardness sufficiently small for showing, when bonding the chip onto the circuit board, a deformation thereby at least a top portion of each of the bumps is made contact with pads provided on the circuit board.

REFERENCES:
patent: 5283468 (1994-02-01), Kondo et al.
patent: 5461197 (1995-10-01), Hiruta et al.

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