Extended travel wire bonding machine

Details Extended travel wire bonding machine Extended travel wire bonding machine

1995-12-18

1998-09-29

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 45, H01L 2160

Patent

active

058135901

ABSTRACT:
An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.

REFERENCES:
patent: 3960309 (1976-06-01), Hazel
patent: 4768698 (1988-09-01), Brown et al.
patent: 4877173 (1989-10-01), Fujimoto et al.
patent: 4912843 (1990-04-01), Dederer
patent: 5082165 (1992-01-01), Ishizuka
patent: 5340011 (1994-08-01), Sanchez

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