Metal fusion bonding – Process – Plural joints
Patent
1984-09-20
1987-01-06
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228 443, B23K 3102
Patent
active
046340432
ABSTRACT:
A head (45) engages a chip (10) having peripheral sides (16), and then engages the chip (10), to a workpiece (35) for bonding chip (10) to a substrate (30). Body (46) has a lower portion terminating in a downwardly presented, working face (48). For receiving chip (10), face (48) has a cavity (54) formed by a plurality of inwardly and upwardly directed surfaces (56). Such surfaces (56) engage upper edges of, and position a chip (10) such that at least a portion of the peripheral sides (16) protrude from working face (48). Body (46) includes a vacuum bore (58) adapted for connection between face (48) and a vacuum for removably engaging and holding chip (10) against surfaces (56). Pockets (60) are also provided in face (48) and connected to a vacuum for moving air streams toward face (48) at the sides (16) of an engaged chip ( 10). Such streams are sufficient in force, direction and distribution around the sides (16) that when an engaged chip (10) is moved adjacent to a free workpiece (35), the air streams capture portions (38) and hold workpiece (35) against chip (10). The chip (10) and the workpiece (35) may be simultaneously registered to a site (32) on a heated substrate (30). Then workpiece (35) becomes liquefied and is uniformly applied and reacted to contact surfaces for the bonding. The pockets (60) may be directly supplied by the same vacuum for engaging chip (10) or to a different vacuum. Alternatively, the pockets (60) may open into cavity (54) such that a vacuum sufficient to engage chip (10) and then the workpiece (35).
REFERENCES:
patent: 3458102 (1969-07-01), Zanger et al.
patent: 3568307 (1971-03-01), Zanger et al.
patent: 3584859 (1971-06-01), Siron
patent: 3676911 (1972-07-01), Austin
patent: 3695502 (1972-10-01), Gaiser
patent: 3873144 (1975-03-01), Diepeveen
patent: 4295596 (1981-10-01), Doten et al.
AT&T - Technologies, Inc.
Godici Nicholas P.
Koba Wendy W.
Reid G. M.
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