Method of making a lead frame for integrated circuits

Details Method of making a lead frame for integrated circuits Method of making a lead frame for integrated circuits

1984-10-26

1987-01-06

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

357 70, H01R 4300

Patent

active

046335838

ABSTRACT:
A lead frame for integrated circuits has a central opening in which there is fitted a metal piece having alternate recesses and projections, the recesses fitting over inner ends of leads of the lead frame and the projections fitting in gaps between the inner lead ends. The metal piece includes slots and cut-outs to allow its comb-shaped members to bend independently of each other. After the lead frame has been fused to a ceramic substrate, the metal piece can be removed by being pulled upwardly with a relatively small force applied. The metal piece has a pair of pull tabs. For fabricating such a lead frame, the metal piece is stamped out of an integral metal plate structure having the leads and support frame integral with the leads. Then, the stamped metal piece is pushed back so as to fit with the leads of the lead frame.

REFERENCES:
patent: 4415917 (1983-11-01), Chiba et al.
patent: 4486948 (1984-12-01), Chiba et al.

Affiliated with

Also associated with

Rating

Method of making a lead frame for integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a lead frame for integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a lead frame for integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-674577