Process for making a multilayer interconnect system

Metal working – Method of mechanical manufacture – Electrical device making

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29628, 174 685, 204 15, 228188, B41M 308

Patent

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039539245

ABSTRACT:
A process for making an interconnect system for a multilayer circuit pattern. The interconnect system is formed having minimized through-hole space consumption so as to be suitable for high density, closely meshed circuit patterns.

REFERENCES:
patent: 3098951 (1963-07-01), Amer et al.
patent: 3152938 (1964-10-01), Osifchin et al.
patent: 3324014 (1967-06-01), Modjeska
patent: 3835531 (1974-09-01), Luttmer

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