Heat sink for direct attachment to surface mount electronic devi

Details Heat sink for direct attachment to surface mount electronic devi Heat sink for direct attachment to surface mount electronic devi

1997-10-22

2000-08-01

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 174 163, 361704, H05K 720

Patent

active

060976039

ABSTRACT:
A heat sink adapted to thermally couple to a surface mounted heat generating electronic device package in a manner which provides an increased thermal path between the heat sink and the electronic device package. The heat sink is typically mounted piggyback on a heat generating electronic device package which is surface mounted to a printed circuit board or other substrate. The heat sink comprises thermal legs which extend from the heat sink body and are thermally coupled to thermal leads of the heat generating electronic device package.

REFERENCES:
patent: 3572428 (1971-03-01), Monaco
patent: 3670215 (1972-06-01), Wilkens
patent: 4521828 (1985-06-01), Fanning
patent: 4544942 (1985-10-01), McCarthy
patent: 4914551 (1990-04-01), Anschel
patent: 5546275 (1996-08-01), Moutrie
patent: 5611393 (1997-03-01), Vasconcelos
patent: 5647748 (1997-07-01), Mills
patent: 5710745 (1998-01-01), Getreuer
patent: 5804875 (1998-09-01), Remsburg

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