Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-02-12
2000-08-01
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361700, 174 152, 174 17VA, 16510433, 165185, 622592, 16223, G06F 120, H05K 720
Patent
active
060975962
ABSTRACT:
Heat transfer through a heat pipe from a heat source on one side of a hinge to a heat dissipation capability on the other side of the hinge is achieved by providing a rotatable coupler with a thermal transfer body mounted on the side of the hinge away from the heat source and wherein a rotational interface surface area between the thermal transfer body and the heat pipe is larger than the outside of the heat pipe.
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Mochizumi et al; "Hinged Heat Apes For Cooling Notebook PC's " Thirteenth IEEE SemiTherm Symposium, 1997, pp. 64-72.
A. Yu, "The Future of Microprocessors" IEEE Micro 1996 pp. 46-53.
Cipolla Thomas Mario
Mok Lawrence Shungwei
International Business Machines - Corporation
Lea-Edmonds Lisa
Morris Daniel P.
Picard Leo P.
Riddles Alvin J.
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