Semiconductor plastic package, metal plate for said package, and

Details Semiconductor plastic package, metal plate for said package, and Semiconductor plastic package, metal plate for said package, and

1999-01-27

2000-08-01

Williams, Alexander O.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257713, 257738, 257737, 257777, 257778, 257774, 257700, 257678, 257675, 257692, H05K 100, H05K 114, H01L 2312, H01L 2352

Patent

active

060970898

ABSTRACT:
There is provided a semiconductor plastic package in the form in which at least one semiconductor chip is mounted on a small-sized printed wiring board, a metal plate for the above package and a method of producing a copper-clad board for the above package. More particularly, there is provided a semiconductor plastic package suitable for relatively high-watt, multi-terminal and high-density semiconductor plastic packages such as a microprocessor, a micro-controller, ASIC and graphic, and a method of producing the same.

REFERENCES:
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patent: 5453641 (1995-09-01), Mundinger et al.
patent: 5581122 (1996-12-01), Chao et al.
patent: 5602491 (1997-02-01), Vasquez et al.
patent: 5659458 (1997-08-01), Patchen
patent: 5708567 (1998-01-01), Shim et al.
patent: 5796589 (1998-08-01), Barrow
patent: 5847936 (1998-12-01), Forehand et al.
patent: 5923084 (1999-07-01), Inoue et al.
patent: 5998875 (1999-12-01), Bodo et al.
patent: 6014318 (2000-01-01), Takeda

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