Electronic device and semiconductor package

Details Electronic device and semiconductor package Electronic device and semiconductor package

1998-08-26

2000-08-01

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257787, 257793, 257783, 257693, 257706, 257707, H01L 2302, H01L 2348, H01L 2352, H01L 2940

Patent

active

060970855

ABSTRACT:
The electronic device has a structure that a semiconductor package is mounted on a mother board. To relieve stress caused by cyclic thermal load and applied to solder bumps that are electrically and mechanically connect the semiconductor package and the mother board, a shape-holding plate (stiffener) adhered to a wiring film is composed of a metal with a thermal expansion coefficient of 13.times.10.sup.-6 to 17.times.10.sup.-6 almost close to that of a glass-epoxy wiring substrate as the mother board. Examples of the metal are 25Cr-20Ni stainless steel or copper alloy containing 0.01 to 0.03% by weight of Zr.

REFERENCES:
patent: 5760465 (1998-06-01), Alcoe et al.
patent: 5835355 (1998-11-01), Dordi
patent: 5900312 (1999-05-01), Sylvester
patent: 5925934 (1999-07-01), Lim
K. Iwasaki et al., "Thermal Fatigue Analysis for Solder Bump in BGA Packages", Advances in Electronic Packaging, vol. 19-2 (1997).

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