Printing apparatus

Photocopying – Contact printing – Exposing on sensitized printing press plate or cylinder

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Details

355 95, G03B 2704

Patent

active

044404930

ABSTRACT:
In an apparatus for printing a mask pattern on a wafer for manufacturing a semiconductor circuit element, the exposure of the mask pattern is effected by being divided into a plurality of times. Each time the divided exposure is effected, the relative positional relation of the mask pattern and the wafer is made to differ by a minute amount. Thereby, a mask pattern thinner than the line width of the mask pattern is formed on the wafer.

REFERENCES:
patent: 2382674 (1945-08-01), Staud
patent: 3521058 (1970-07-01), Mittelstedt
patent: 3742229 (1973-06-01), Smith, et al.
patent: 3844655 (1974-10-01), Johannsmeier
patent: 4105328 (1978-08-01), Wasson et al.

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