Electronic components comprising polymide dielectric layers

Details Electronic components comprising polymide dielectric layers Electronic components comprising polymide dielectric layers

1986-11-20

1989-10-03

Ives, P. C.

Stock material or miscellaneous articles

Composite

Of polyimide

428913, 427 12, 427 96, 525426, 525420, 522174, B32B 1508, B32B 2734

Patent

active

048716197

ABSTRACT:
An electronic component is formed by in situ curing a polymerizable oligomer which is end capped with vinyl and/or acetylenic end groups. The polymerizable oligomer is selected from the group consisting of polyamic acids, polyamic esters, polyisoimides, and mixtures thereof.

REFERENCES:
patent: 3985597 (1976-10-01), Zielinski
patent: 4168367 (1979-09-01), D'Alelio
patent: 4251420 (1981-02-01), Antonoplos et al.
patent: 4316845 (1982-02-01), D'Alelio et al.
patent: 4347306 (1982-08-01), Takeda et al.
patent: 4481340 (1984-11-01), Mimema et al.
patent: 4654223 (1987-03-01), Araps et al.

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