Multi-layer glass ceramic module with superconductor wiring

Details Multi-layer glass ceramic module with superconductor wiring Multi-layer glass ceramic module with superconductor wiring

1999-03-09

2000-08-01

Chaudhuri, Olik

Semiconductor device manufacturing: process

Having superconductive component

438648, 438650, 438608, 438686, 505220, H01L 2100

Patent

active

060965657

ABSTRACT:
A multilayer ceramic substrate electronic component is provided having high temperature superconductor material circuitry. The high temperature superconductor material is preferably yttrium-barium-copper-oxide and is encased within a noble metal such as silver or gold when forming the surface circuitry or filling of the vias. The noble metal layers preferably have through-openings to enable direct connection of circuitry to the encased superconductor layer. A method is also provided for fabricating such multilayer ceramic substrate electronic components.

REFERENCES:
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patent: 4803110 (1989-02-01), Ahn et al.
patent: 4902371 (1990-02-01), Andris et al.
patent: 4954480 (1990-09-01), Imanaka et al.
patent: 5274268 (1993-12-01), Yamazaki
patent: 5747873 (1998-05-01), Talisha
Van Nostrand Reinhold, "Microelectronics Packaging Handbook", 1989, pp. 476-493.

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