Bonding thermoplastic layers via electrical heating

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

1563043, 219 1043, 219 1053, B32B 3120

Patent

active

048714127

ABSTRACT:
A method of bonding a thermoplastic layer (22), such as APC-2, to a substrate (21) in which the thermoplastic layer (22) comprises electrical conductors such as carbon fibres, embedded in thermoplastic material such as PEEK. The method comprises placing the thermoplastic layer (22) in contact with the substrate (21); and inducing electric currents in the conductors whereby heat generated by the currents passing through the conductors causes thermoplastic material to bond the layer to the substrate.

REFERENCES:
patent: 4029837 (1977-06-01), Leatherman
patent: 4313777 (1982-02-01), Buckley

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