Process for the manufacture of thin films of semiconductor mater

Details Process for the manufacture of thin films of semiconductor mater Process for the manufacture of thin films of semiconductor mater

1996-09-12

1998-02-03

Niebling, John

Fishing, trapping, and vermin destroying

437974, H01L 21265

Patent

active

057143951

ABSTRACT:
The process includes the following steps: implantation of ions (12) in a semi-conducting wafer (10), to create a cleavage layer of gaseous microblisters (16) in the wafer, heat treatment of the wafer, in order to cause separation of a surface layer (18) from the rest of the wafer, along the layer of microblisters. According to the invention, the implantation is carried out at a depth equal to or greater than a given minimum depth so that the thin film obtained is rigid, and so that the heat treatment can release it.

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